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 APTGT50DSK60T3G
Dual Buck chopper Trench + Field Stop IGBT(R) Power Module
13 14
VCES = 600V IC = 50A @ Tc = 80C
Application * AC and DC motor control * Switched Mode Power Supplies
Q1 18 19
Q2 11 10 22 23 7 8 CR2
CR1
29 15
30
31 R1
32 16
Features * Trench + Field Stop IGBT(R) Technology - Low voltage drop - Low tail current - Switching frequency up to 20 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - Avalanche energy rated - RBSOA and SCSOA rated * Kelvin emitter for easy drive * Very low stray inductance - Symmetrical design * High level of integration * Internal thermistor for temperature monitoring Benefits * Stable temperature behavior * Very rugged * Solderable terminals for easy PCB mounting * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Easy paralleling due to positive TC of VCEsat * Low profile * Each leg can be easily paralleled to achieve a single buck of twice the current capability. * RoHS Compliant
28 27 26 25 29 30
23 22
20 19 18 16 15
31 32 2 3 4 7 8 10 11 12
14 13
All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 ...
Absolute maximum ratings
Symbol VCES IC ICM VGE PD RBSOA
Parameter Collector - Emitter Breakdown Voltage Continuous Collector Current TC = 25C TC = 80C TC = 25C TC = 25C TJ = 150C
Pulsed Collector Current Gate - Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area
V W
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
www.microsemi.com
1-5
APTGT50DSK60T3G - Rev 1 June, 2006
Max ratings 600 80 50 100 20 176 100A @ 550V
Unit V A
APTGT50DSK60T3G
All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics
Symbol Characteristic ICES VCE(sat) VGE(th) IGES Zero Gate Voltage Collector Current Collector Emitter Saturation Voltage Gate Threshold Voltage Gate - Emitter Leakage Current Test Conditions VGE = 0V, VCE = 600V Tj = 25C VGE =15V IC = 50A Tj = 150C VGE = VCE , IC = 600A VGE = 20V, VCE = 0V Min Typ 1.5 1.7 5.8 Max 250 1.9 6.5 600 Unit A V V nA
5.0
Dynamic Characteristics
Symbol Characteristic Cies Coes Cres Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Tf Eon Eoff Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy
Test Conditions VGE = 0V VCE = 25V f = 1MHz Inductive Switching (25C) VGE = 15V VBus = 300V IC = 50A R G = 8.2 Inductive Switching (150C) VGE = 15V VBus = 300V IC = 50A R G = 8.2 VGE = 15V Tj = 25C VBus = 300V Tj = 150C IC = 50A Tj = 25C R G = 8.2 Tj = 150C
Min
Typ 3150 200 95 110 45 200 40 120 50 250 60 0.3 0.43 1.35 1.75
Max
Unit pF
ns
ns
mJ mJ
Chopper diode ratings and characteristics
Symbol Characteristic VRRM IRM IF VF trr Qrr Er
Maximum Peak Repetitive Reverse Voltage
Test Conditions Tj = 25C Tj = 150C Tc = 80C Tj = 25C Tj = 150C Tj = 25C Tj = 150C Tj = 25C Tj = 150C Tj = 25C Tj = 150C
Min 600
Typ
Max 250 500
Unit V A A
Maximum Reverse Leakage Current DC Forward Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Energy
VR=600V
IF = 50A VGE = 0V
IF = 50A VR = 300V
di/dt =1800A/s
C mJ
www.microsemi.com
2-5
APTGT50DSK60T3G - Rev 1 June, 2006
50 1.6 1.5 100 150 2.6 5.4 0.6 1.2
2
V ns
APTGT50DSK60T3G
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol Characteristic R25 Resistance @ 25C B 25/85 T25 = 298.15 K Min Typ 50 3952 Max Unit k K
RT =
R 25
1 1 RT : Thermistor value at T exp B 25 / 85 T - T 25
T: Thermistor temperature
Thermal and package characteristics
Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case Thermal Resistance Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight IGBT Diode
Min
Typ
Max 0.85 1.42 175 125 100 4.7 110
Unit C/W V C N.m g
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
To heatsink
M4
2500 -40 -40 -40 2.5
SP3 Package outline (dimensions in mm)
1
12
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
www.microsemi.com
3-5
APTGT50DSK60T3G - Rev 1 June, 2006
17
28
APTGT50DSK60T3G
Typical Performance Curve
Output Characteristics (VGE=15V) Output Characteristics 100
T J = 150C VGE=19V
100
T J=25C
80
IC (A)
TJ=125C
80 IC (A)
TJ=150C VGE=13V
60 40 20 0 0 0.5 1
TJ=25C
60
VGE=15V
40 20 0
VGE =9V
1.5 VCE (V)
2
2.5
3
0
0.5
1
1.5 2 VCE (V)
2.5
3
3.5
100 80 60 40 20 0 5
Transfert Characteristics 3.5
TJ =25C
Energy losses vs Collector Current 3 2.5 E (mJ)
VCE = 300V VGE = 15V R G = 8.2 TJ = 150C
Eoff
IC (A)
2 1.5 1
Er
T J=125C T J=150C TJ=25C
0.5 0 11 12 0 20 40 IC (A) 60 80
Eon
6
7
8
9
10
100
VGE (V) Switching Energy Losses vs Gate Resistance 3 2.5 E (mJ) 2 1.5 1
Er VCE = 300V VGE =15V IC = 50A TJ = 150C
Reverse Bias Safe Operating Area 125
Eoff
Eon
100 IC (A) 75 50 25 0
VGE=15V T J=150C R G=8.2
0.5 0 5 15
Eon
25 35 45 55 Gate Resistance (ohms)
65
0
100
200
300 400 VCE (V)
500
600
700
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 1 Thermal Impedance (C/W) 0.8 0.6 0.4 0.2 0.9 0.7 0.5 0.3 0.1 Single Pulse 0.0001 0.001 0.01 0.1 1 10
IGBT
0.05 0 0.00001
Rectangular Pulse Duration in Seconds
www.microsemi.com
4-5
APTGT50DSK60T3G - Rev 1 June, 2006
APTGT50DSK60T3G
Operating Frequency vs Collector Current Fmax, Operating Frequency (kHz) 120 100 80 60 40 20 0 0 20 40 IC (A) 60 80
Hard switching ZVS ZCS V CE =300V D=50% RG=8.2 T J=150C
Forward Characteristic of diode 100 80 60 40 20
T J=25C T J=125C TJ =150C
IF (A)
T c=85C
0 0 0.4 0.8 1.2 1.6 V F (V) 2 2.4
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 1.6 Thermal Impedance (C/W) 1.4 1.2 1 0.8 0.6 0.4 0.2 0.9 0.7 0.5 0.3 0.1 Single Pulse 0.0001 0.001 0.01 0.1 Rectangular Pulse Duration in Seconds 1 10
Diode
0.05 0 0.00001
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
www.microsemi.com
5-5
APTGT50DSK60T3G - Rev 1 June, 2006


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